Test link - Jan 99

To do
Bug list
Lessons learned
Contact info

Summary

The purpose of this trip was to characterize the behavior of a joint in varying thermal enviroments. The trip as a whole went very well. It lasted from Jan 3, 1999 to Feb 6, 1999. Data from these tests may or may not be published here in the future. We kept a web page that we updated everyday. Below are links to each day.
The initial data indicates that the friction characteristic of the joint over the temperature range can increase by a factor of around 5. The electronics appear to be able to fully perfom up to a temperature of about 65c, and perform limited operations up to around 85c. On the cold side, the electronics didn't show any weakness down to a temperature of -40c. More to come as it becomes available.

Any questions about this trip or this page can be sent to the lab

Days gone by.

Jan 27
Jan 26
Jan 25
Jan 22
Jan 21
Jan 20
Jan 19
Jan 18

Jan 15
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Jan 3
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Brought to you courtesy of Bug Stompers Int'l!!!