Test link - Jan 99

To do
Bug list
Lessons learned
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Summary

  The purpose of this trip was to characterize the behavior of a joint in varying thermal enviroments.  The trip as a whole went very well. It lasted from Jan 3, 1999 to Feb 6, 1999.  Data from these tests may or may not be published here in the future.  We kept a web page that we updated everyday.  Below are links to each day.
    The initial data indicates that the friction characteristic of the joint over the temperature range can increase by a factor of around 5.  The electronics appear to be able to fully perfom up to  a temperature of about  65c, and perform limited operations up to around 85c.  On the cold side, the electronics didn't show any weakness down to a temperature of -40c.   More to come as it becomes available.   

Any questions about this trip or this page can be sent to the lab
 
 

Days gone by.


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